产品中心 / PRODUCT
Batch-type RCA Cleaning Equipment
Batch-type RCA Cleaning Equipment
Features
· Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer).
· Various additive technologies available.
· Wafer thickness down to 120μm.
· With dry clean area and self-cleaning system.
· Quick inline bath change.
· Available with MES, RFID system, inline weight testing optional.
Previous：
Reactive Plasma Deposition
Next：
Customer Service
|
COPYRIGHT ? 2018-2020. S.C New Energy Technology Corporation,All Rights Reserved
粤ICP备05146584号-1
三五互联
TOP